Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...
Shenzhen PEAK Technology Co., Ltd [Electronic Components & Supplies] [Other PCB & PCBA] [2024-01-25 12:50:29 ]
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer PCB Own lamination process to convenient production for Multilayer PCB ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-09-28 17:09:14 ]
HDI PCB Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm)≥0.075 High Density Interconnector Founded in 2007,PEAK ...
Shenzhen PEAK Technology Co., Ltd [Electronic Components & Supplies] [Multilayer PCB] [2023-08-25 14:18:03 ]
Previous image Next image Number of layers: 16 Surface finish: ENIG Base material: FR4 Thickness: 3.0mm Min. hole diameter:0.35mm size：420×560mm Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Aspect Ratio: 9:1 Special process: via-in-pad Impedance Control Press Fit Hole ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-07-21 10:02:01 ]
Previous image Next image Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8:1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter:0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-07-21 10:01:40 ]
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of 8 Layer ENIG Half Hole Custom Made PCB Own lamination process to convenient production ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-05-30 10:21:43 ]
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-05-30 10:21:14 ]
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-05-30 10:20:40 ]
Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-05-30 10:20:15 ]
Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-05-30 10:19:46 ]
Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 8.5/3.5mil Thickness: 0.8mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of Two Sided PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-05-30 10:19:24 ]
Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-04-10 11:03:42 ]
Number of layers: 4 size：80*88mm Surface finish: ENIG Base material: Rogers FR4 4350B Min. hole diameter: 0.3mm Minimum Line Width：0.230mm Minimum Line Space：0.170mm Thickness: 1.0mm Advantages Of 4 Layer Rogers FR4 PCB Own lamination process to convenient production for ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-04-10 11:03:04 ]
Number of layers: 2 Surface finish: ENIG Base material: Taconic TLY-5A Min. hole diameter: 0.3mm Outer Layer W: 1.046mil Outer layer S: /mil Thickness: 0.94mm Advantages Of 2 Layer Taconic PCB Own lamination process to convenient production for Multilayer pcb product and ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-04-10 11:02:45 ]
Number of layers: 2 size: 184.2*158.9mm Surface finish: LF-HASL Base material: Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width: 0.227mm Minimum Line Space: 0.127mm Thickness: 0.7mm Advantages Of 2 Layer Rogers LF-HASL PCB Own lamination process to convenient ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-04-10 11:02:25 ]
Number of layers: 2 size: 96.45*87.73mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers ENIG RF Circuit Board Own lamination process to convenient ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-04-10 11:02:02 ]
Number of layers: 2 size: 98.45*49.45mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.5mm Minimum Line Width：/mm Minimum Line Space：0.139mm Thickness: 0.35mm Advantages Of 2 Layer Rogers PCB Own lamination process to convenient production for ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-04-10 11:01:45 ]
Number of layers: 2 Surface finish: ENIG Base material: F4B Min. hole diameter: 0.8mm Outer Layer W: 6mil Outer layer S: 6mil Thickness: 1.0mm Advantages Of 2 Layer F4B PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-04-10 11:01:23 ]
Material: Polyimide FCCL Surface Finish: HASL/OSP/ENIG Copper Thickness: 1oz / 1/2 oz/ 1/3 oz Board Thickness: 0.07-0.5MM Application: 3D Printer We(Mondo Technology) have the ability to manufacture different FPC (Flexible Printed Circuit Board/Flexible PCB) with different ...
Shenzhen Mondo Technology Co., Ltd. [Electronic Components & Supplies] [FPC] [2023-03-12 20:08:05 ]
Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for ...
Xinfeng Huihe Circuits Co., Ltd. [Electronic Components & Supplies] [Electronic Data Systems] [2023-02-08 10:06:43 ]