Black XPE Conductive Foam Packing Insert For Electronic products

Place of Origin:China (Mainland)
Minimum order:1
Material:XPE foam
Certificate:SGS, ISO9001, ROHS
Size:Customized Accept
Thickness:1-100mm
Color:black
Process Type:Pulp Moulding
Usage:Electronic

Applications of XPE foam in Microelectronics industry

A. Semiconductor industry

1. Integrated circuits :Digital IC , monolithic IC , thick-film IC , the MOS containing IC , hybrid IC and so on ; characterized by the pattern and packaging;

2. Semiconductor tube : diodes, transistors / crystal , thyratron , etc .

3. Being used as pulg-in sheet inserted by IC pin ,conductive foam makes the electric potential difference between the PINs is zero , not only anti-static ,but also fixing and protecting the IC pin.

B. Applications in PCB and various boards

1. Containing the aforementioned components of the PCB , board;

2. Module containing the aforementioned components , devices, such as the light source modules, photovoltaic modules , communication modules , IGBT modules,etc;

3. Compounded with anti-static ,buffering and circulating properties,conductive IXPE foam trays for Hard Disks,Cell phones, Motherboards and Memory Bar have irreplaceable advantages to the traditional injection molding trays,which make sure the maximum protection to those devices when circulating .

C. The use of the aforementioned components, boards, modules packages, electronics, telecommunications industry

1. Mobile phones, computers/notebook computers in particular, high-definition television and other consumer devices;

2. Cable television network,IP,IT and other communications,video,wired and wireless networks.

3. Compared with traditional hollow board,conductive IXPE foam board is not only flexible and buffering but also non-traumatic to electric devices and hands,while traditional hollow board is very easy to scratch electronic and hand in the process of use. The most important thing is that IXPE foam\'s life is as several times longer as hollow boards\'.