(1)purity:99.95%
Conventional size:300mesh,400 mesh,1-3µm 3-5µm
(2)application:suitable for low silver content low temperature curing electronic paste, such as: conductive adhesive, shielding silver paste, etc..
high purity sponge titanium Ti
high purity brass Cu powder
high purity metal bronze Cu powder
high purity metal lead Pb powder
high purity metal carbonyl iron Fe powder