AOI DCB Automatic Ceramic Substrate Defect Inspection Equipment
Quick Detail
- Sample thickness:1-2mm
- Object size:Max：190×140mm
- Weight:1500kg
- Detectable flaw:short-circuit,connecting line, chipped edge, residual copper,
- Inspecting Speed:9.6s/pcs
- Suitable object:DCB
- Dimension:1930mm (L) ×1430mm (W) × 1900mm (H)
Specifications
| NO | Item | Parameter |
| 01 | Suitable object | DCB |
| 02 | Object size | Max：190×140mm； |
| 03 | Sample thickness | 1-2mm |
| 04 | CCDPixel |
AOI 1：13um/Pixel
AOI 2/3：24um/Pixel |
| 05 | Board warpsolution | Auto focus |
| 06 | CAM format | Gerber |
| 07 | Image Processingmethod | CCDColor software |
| 08 | InspectingSpeed | 9.6s/pcs |
| 09 | Data source | CAM+graphic scanning |
| 10 | Auxiliary function | Laser marking |
| 11 | Defect Confirmation | AOIon-line |
| 12 | Positioning Way ofceramic substrate | Automatic |
| 13 | Defectsearching method | Image contrast+ logic algorithm |
| 14 | Detectable flaw |
AOI 1:short-circuit,connecting line, chipped edge,residual copper,copper deficiency, copper surface stain, copper
surface oxidation,cutting dislocation, ink disconnection, ink shedding, ink contamination,reverseresistance welding
mark,resistance weldingdislocation,resistance weldingpinhole., etc .
AOI 2：dint, scratches,wrinkles, bumps； AOI 3：bubble,indentation; |
