LPKF ProtoLaser U
Description
| LPKF ProtoLaser UMicromaterial processing with laser technology |
Product Details
LPKF ProtoLaser UMicromaterial processing with laser technology
The LPKF ProtoLaser U is able to process almost all types of material in mini series and prototype production: ceramics, LTCC (Greentape), FR4, protective films and
metal foils, or flex and rigid-flex materials.
The laser system can precisely depanel separate PCBs from a large panel array (assembled or
unassembled), cuts LTCC and prepreg, structures TCO/ ITO and etching resists or opens up solder resists and protective films. The LPKF ProtoLaser U can drill holes or microvias with a minimum diameter of only 50
metal foils, or flex and rigid-flex materials.
The laser system can precisely depanel separate PCBs from a large panel array (assembled or
unassembled), cuts LTCC and prepreg, structures TCO/ ITO and etching resists or opens up solder resists and protective films. The LPKF ProtoLaser U can drill holes or microvias with a minimum diameter of only 50
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