Diodes
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Product Details
Bourns can now provide designers with an integrated passive & active device solution that saves PCB real estate while offering remarkable electrical performance. The designers of compact electronic systems, especially handheld/wireless devices, are faced with tightening board space constraints, driving the requirement for alternative passive and active component technologies.In the last several years, there has been somewhat of a revolution in the I.C. packaging world with the birth of a generation of extremely space-efficient packaging solutions. Using Thin Film on Silicon wafer fabrication technology, Bourns offers the capability to integrate resistors, capacitors, inductors and diodes into a single monolithic device with minimal packaging overhead.Thin Film on Silicon and bipolar diode technology using DFN packaging has been put to use in "Portable Electronics" applications where the customer has specified a particular electrical response characteristic for a minimum real estate allowance. Handheld wireless devices (in particular, cell phones and PDAs) often have data and/or audio ports that connect the device to other external devices such as laptop computers and headsets.Thin Film on Silicon and bipolar diode technology with QSOP and NSOIC packages is widely used in applications that require cost reductions while also providing consistent and reliable performance. Typical applications include telecom base stations, network servers, PCs and peripheral devices.Bourns can now provide designers with an integrated passive and active solution that provides: 1. Reduction in overall package size and maximum space saving. 2. Elimination of existing package wire-bonds with their associated unwanted high frequency parasitic elements using a DFN package solution. 3. Low cost solution due to shrinking of the Bill of Materials, Pick and Place cycles reduced and decreasing overall product manufacturing costs. 4. Simple package construction while providing high reliability performance. Series 2DTA Series Circuit Configuration Type Bus Terminator Supply Voltage (VDD - VSS) -0.3 V to +7 V Channel Voltage (VIN) -0.3 V to +(VDD+0.5) V Forward Voltage 0.75 V @ 16 mA Diode Capacitance 5 pF Max RoHS Compliant Yes Material Declaration Sheet QSOP 24
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