We supply RoHS Compliant PCB Assemblies-Reg. |
Please arrange to send us details regarding your requirements. Please feel free to contact us for any clarifications.
With the above facilities / background we commit that we can fulfill your requirements with high quality standards and deliver the Products at right time.
Well experienced about 22 years in the field of PCB Assemblies Component Procurement, Machine Soldering and ESD protection, reliable Soldering, failure Analysis of Electronic Components, PCB fabrication and inspection
PROMOTERS EXPERIENCE
We are importing Components from more than 10 Countries.
We have best inward inspection system to inspect all the components
We are following stringent and reliable process control method for each and every process.
Our assembly area is fully equipped with antistatic setup.
We have imported Component lead forming machine from M/s OLAMEF Italy.
We have Micro Controller based Wave Soldering Machine.
Our EMS facility is equipped with Temperature Controlled baking oven for baking the PCBs.
We have excellent resources of programming of Micro Controller and testing of PCB Assemblies.
We have a dedicated R&D facility for developing Micro Controller based projects
We have a latest Ultra sonic Cleaning Machine for uniform cleaning.
We have imported make of Temperature Controlled Soldering Irons.
We have Sufficient Storage for Keeping Customer items.
90 members of Trained Operators & 25 Engineers.
Separate Quality Control Department for 100% inspection by Imported Magnifier.
We have 30H.P Power Capacity.
We undertake SMD Soldering using Screen Printer & Reflow Oven.
We have state-of-the-art SMT line Equipments from M/s. Essemtec, Switzerland.
Electronics Manufacturing Services
Dear Prospective Customers,
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. ...
As GreensTone CEO said, GreensTone has over 10 years of experience in the China turn key pcb assembly industry. Our core values are centered around customer service, engineering, manufacturing, and product solutions. In the beginning, we gained a stellar reputation through ...
GreensTone provides china through hole pcb assembly services to meet conventional lead assembly requirements of a variety of industries. We provide single, double-sided, as well as high-density multilayer Plated through hole assembly services to meet low to mid volume ...
SMT PCB Assembly As SMT assembly supplier, GreensTone SMT production runs with automated SMT production processes, including single or double-sided component insertions. STM components include passive Component: components as small as 01005, 0201,0402. ICs like BGA: handle BGA ...
The benefits of GreensTone\'s turn-key china pcb prototype service can be utilized for clients who require a convenient, quick turnaround for the prototyping of printed circuit board designs. GreensTone, a China prototype pcb assembly supplier, is a global specialist in ...
China prototype pcb assembly is the process of designing, manufacturing, and assembling printed circuit boards (PCBs) for use in a variety of electronic products. It involves using layers of copper, insulation, and other materials to form a circuit board that can be connected ...
GreensTone specializes in the one stop PCB assemblies, including: Circuit board assembly Surface mount technologies (SMT) Pin Through Hole Complex secondary operations Automated conformal coating Inspection Automated optical inspection (AOI) GreensTone conducts upfront ...
IC Substrate&Substrate-Like PCB CSP/FC-CSP/SIP/FC-BGA/WB-CSP FR4/BT/High-Speed Material Trace Width/Space 12/12μm SM Registration:±20μm Strict SM Flatness Control ≤5μm Founded in 2007,PEAK ...
High Speed PCB Panasonic Megtron4/6/7 TU-872SLK/Isola-FR408HR,etc Impedance Tolerance ±5%(min) Dimension Accuracy ±0.02mm(min) Line Width/Space Accuracy ±5% Founded in 2007,PEAK ...
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. ...