Payment Terms: | T/T |
Min. Line Width: | 0.2MM |
Min. Hole Size: | 0.25MM |
Board Thickness: | 1.6MM |
Copper Thickness: | 1OZ |
Base Material: | FR4 |
Model Number: | JB094 |
Brand Name: | JB |
Place of Origin: | Guangdong China (Mainland) |
Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.
Min. parts footpins: 0201
Min. SMT Ptich: 12 mil (0.2 mm)
Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin
Impedance: +/- 10%
Warpage: 0.5 %
Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)
Micro Via: 4 mil (0.1 mm)
Hole to Edge Tolerance: +/- 5 mil (0.13 mm)
Hole to Hole Tolerance: +/- 3 mil (0.08 mm)
Minimum Via Size: 8 mil (0.2 mm)
Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)
Layer to Layer Registration: +/- 5 mil (0.13 mm)
Maximum Thickness(10layers): 200 mil (5.0 mm)
Minimum Thickness (8 Layers): 24 mil (0.6 mm)
Minimum Thickness (6 Layers): 16 mil (0.4 mm)
Minimum Thickness (4 Layers): 12 mil (0.3 mm)
Minimum Thickness (2 Layers): 4 mil (0.1 mm)
Layer Count & Thickness: 2-12 layers
Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples
Line Width & Spacing:
Maximum Panel Size: 26 X 26 (660mm X 660mm)
Material used: FR4, High Tg Minimum 170
Buried blind hole PCB
GreensTone provides china through hole pcb assembly services to meet conventional lead assembly requirements of a variety of industries. We provide single, double-sided, as well as high-density multilayer Plated through hole assembly services to meet low to mid volume ...
Our DIP process workers are rich experienced with a variety of products. They can solder them very beautifully. Through hole assembly is used in many fields. The time and money required to complete an through hole mount PCB Assembly makes it especially popular for large ...
Previous image Next image Number of layers: 16 Surface finish: ENIG Base material: FR4 Thickness: 3.0mm Min. hole diameter:0.35mm size:420×560mm Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Aspect Ratio: 9:1 Special process: via-in-pad Impedance Control Press Fit Hole ...
GreensTone provides china through hole pcb assembly services to meet conventional lead assembly requirements of a variety of industries. We provide single, double-sided, as well as high-density multilayer Plated through hole assembly services to meet low to mid volume ...
weight 0.07 kg aperture 5.0 mm long, 5.0 mm right, 6.0 mm long, 6.0 mm right, 7.0 mm long, 7.0 mm right, 8.0 mm long, 8.0 mm right, 9.0 mm long, 9.0 mm right, 10.0 mm long, 10.0 mm right, 11.0 mm long, 11.0 mm right, 12.0 mm long, 12.0 mm right, 15.0 mm long, 15.0 mm right ...
Our DIP process workers are rich experienced with a variety of products. They can solder them very beautifully. Through hole PCB Assembly is used in many fields. The time and money required to complete an through hole PCB Assembly makes it especially popular for large equipment ...
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of 8 Layer ENIG Half Hole Custom Made PCB Own lamination process to convenient production ...
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...
Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...