Delivery Time: | 5-11days |
Package: | vacuuming |
Supply Ability: | 50000 Piece/Pieces per Month |
Minimum Order Quantity: | 5 Piece/Pieces |
Payment Terms: | T/T |
Port: | Shenzhen |
Min. Line Width: | 0.2MM |
Min. Hole Size: | 0.3MM |
Board Thickness: | 1.6MM |
Copper Thickness: | 18UM |
Base Material: | FR4 |
Model Number: | JB115 |
Brand Name: | JB |
Place of Origin: | Guangdong China (Mainland) |
Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.
Min. parts footpins: 0201
Min. SMT Ptich: 12 mil (0.2 mm)
Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin
Impedance: +/- 10%
Warpage: 0.5 %
Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)
Micro Via: 4 mil (0.1 mm)
Hole to Edge Tolerance: +/- 5 mil (0.13 mm)
Hole to Hole Tolerance: +/- 3 mil (0.08 mm)
Minimum Via Size: 8 mil (0.2 mm)
Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)
Layer to Layer Registration: +/- 5 mil (0.13 mm)
Maximum Thickness(10layers): 200 mil (5.0 mm)
Minimum Thickness (8 Layers): 24 mil (0.6 mm)
Minimum Thickness (6 Layers): 16 mil (0.4 mm)
Minimum Thickness (4 Layers): 12 mil (0.3 mm)
Minimum Thickness (2 Layers): 4 mil (0.1 mm)
Layer Count & Thickness: 2-12 layers
Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.
Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples
Line Width & Spacing:
Maximum Panel Size: 26 X 26 (660mm X 660mm)
Material used: FR4, High Tg Minimum 170
PCB -EG01(DS Electro Gold Plating Board)
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