PCB -EG01(DS Electro Gold Plating Board)

Delivery Time: 5-11days
Package: vacuuming
Supply Ability: 50000 Piece/Pieces per Month
Minimum Order Quantity: 5 Piece/Pieces
Payment Terms: T/T
Port: Shenzhen
Min. Line Width: 0.2MM
Min. Hole Size: 0.3MM
Board Thickness: 1.6MM
Copper Thickness: 18UM
Base Material: FR4
Model Number: JB115
Brand Name: JB
Place of Origin: Guangdong China (Mainland)

Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.

Min. parts footpins: 0201

Min. SMT Ptich: 12 mil (0.2 mm)

Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion Tin

Impedance: +/- 10%

Warpage: 0.5 %

Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)

Micro Via: 4 mil (0.1 mm)

Hole to Edge Tolerance: +/- 5 mil (0.13 mm)

Hole to Hole Tolerance: +/- 3 mil (0.08 mm)

Minimum Via Size: 8 mil (0.2 mm)

Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)

Layer to Layer Registration: +/- 5 mil (0.13 mm)

Maximum Thickness(10layers): 200 mil (5.0 mm)

Minimum Thickness (8 Layers): 24 mil (0.6 mm)

Minimum Thickness (6 Layers): 16 mil (0.4 mm)

Minimum Thickness (4 Layers): 12 mil (0.3 mm)

Minimum Thickness (2 Layers): 4 mil (0.1 mm)

Layer Count & Thickness: 2-12 layers

Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.

Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samples

Line Width & Spacing: 

Maximum Panel Size: 26 X 26 (660mm X 660mm)

Material used: FR4, High Tg Minimum 170

PCB -EG01(DS Electro Gold Plating Board)

  • Surface Finishing:Lead Free HALS
  • Min. Line Spacing:0.2MM
  • Min. Line Width:0.2MM
  • Min. Hole Size:0.3MM
  • Board Thickness:1.6MM
  • Copper Thickness:18UM
  • Base Material:FR4
  • Model Number:JB115
  • Brand Name:JB
  • Place of Origin:Guangdong China (Mainland)
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