16 layer PCB(Printed Circuit Board),impedance control

Minimum Order Quantity: 2 Piece/Pieces
Payment Terms: T/T
Port: FOB Shen Zhen
Fob Price: US$10-100FOB Shen Zhen
Min. Line Width: 6mil
Min. Hole Size: 0.25mm
Board Thickness: 2.0mm
Copper Thickness: 1 OZ
Base Material: FR-4
Model Number: J36705m16A
Brand Name: JX
Place of Origin: Guangdong China (Mainland)

Material:FR-4, Rogers, Taconic, Arlon,
Max copper:7 0Z
Max thickness:7.0mm
Finished:Leaded/Lead free HAL/OSP/ENIG/immersion Tin/immersion Silver/Hard Gold
Min trace width/gap:3/3mil
Min hole:6mil(mechanical)/4mil(laser)
Max board size:600x800mm
Aspect rati0:16:1
HDI board with 3 times pressing and 2 tims laser drill
Impedance control board.

Layer count:1-30 layer

Capability of JX PCB(Printed Circuit Board)

PN:J36705m16A
layer count:16
distance from hole to trace:10.0miL
min hole:0.25mm
min trace width/gap:6/5.4miL
aspect ratio:8:1
board thickness:2.0mm  +/-0.1mm
finished treatment:HAL+green oil
board size:304*298.5mm

layer count up to 16
impedance control
HAL lead free
PCB(Printed Circuit Board)with short lead time

  • Surface Finishing:HAL lead free
  • Min. Line Spacing:5.4mil
  • Min. Line Width:6mil
  • Min. Hole Size:0.25mm
  • Board Thickness:2.0mm
  • Copper Thickness:1 OZ
  • Base Material:FR-4
  • Model Number:J36705m16A
  • Brand Name:JX
  • Place of Origin:Guangdong China (Mainland)
8 Layer ENIG Impedance Control PCB
8 Layer ENIG Impedance Control PCB

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer PCB Own lamination process to convenient production for Multilayer PCB ...

Xinfeng Huihe Circuits Co., Ltd.

10 Layer Impedance Control Resin Plugging PCB
10 Layer Impedance Control Resin Plugging PCB

Previous image Next image Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8:1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter:0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness ...

Xinfeng Huihe Circuits Co., Ltd.

4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board
4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...

Xinfeng Huihe Circuits Co., Ltd.

4 Layer ENIG Impedance Control Half Hole Fr4 PCB
4 Layer ENIG Impedance Control Half Hole Fr4 PCB

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...

Xinfeng Huihe Circuits Co., Ltd.

2 Layer OSP Impedance Control Half Hole PCB
2 Layer OSP Impedance Control Half Hole PCB

Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...

Xinfeng Huihe Circuits Co., Ltd.

2 Layer ENIG Impedance Control Half Hole PCB
2 Layer ENIG Impedance Control Half Hole PCB

Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient ...

Xinfeng Huihe Circuits Co., Ltd.

4 Layer High TG Impedance Control Fine Pitch PCB
4 Layer High TG Impedance Control Fine Pitch PCB

Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination ...

Xinfeng Huihe Circuits Co., Ltd.

4 Layer High TG Impedance Control Fine Pitch PCB
4 Layer High TG Impedance Control Fine Pitch PCB

Number of layers: 4 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: Impedance Control Advantages Of 4 Layer High TG Impedance Control Fine Pitch PCB Own lamination ...

Xinfeng Huihe Circuits Co., Ltd.

10 Layer Impedance Control Resin Plugging PCB
10 Layer Impedance Control Resin Plugging PCB

Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8:1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter:0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness Advantages Of 10 Layer ...

Xinfeng Huihe Circuits Co., Ltd.

8 Layer ENIG Impedance Control Half Hole PCB
8 Layer ENIG Impedance Control Half Hole PCB

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 8 Layer ENIG Impedance Control Half Hole PCB Own lamination ...

Xinfeng Huihe Circuits Co., Ltd.