ZLH706 UV Laser Dicng Saw Machine

The ZLH 706 UV Laser Saw is using industrial UV laser generator, linear motor workbench and straight drive rotary platform, assisted by CCD image monitoring and positioning system, to cutting semiconductor wafer.

The machine has mounted with LCD touch screen, man-machine operation interface; the image alignment of the work piece is simple and convenient to improve the operation convenience. The self design software is used in the control system to improve the cutting efficiency. The equipment has high reliability, low cost maintenance and stable performance

Feature

Interactive man-machine operation interface

15” high resolution touch screen;

Easy operation, highly working efficiency;

Laser wave is335nm;

Linear motor workbench with 2um accuracy.

Application

IC wafer, GPP, diode wafer, monocrystalline, polysilicon, amorphous silicon solar cells, scribing dicing for silicon wafer, slotting for LOW-K materials, etc.

Specification

Work size Φ6”
Dicing depth Max.0.3mm
Laser wave 335 nm
Cutting speed 1-150 mm/s
X-axis Drive Linear motor
Stroke(Working range) Max. 160mm
Resolution 0.001mm
Step size 0.001mm
Accuracy <0.006mm/150mm
Repeat accuracy 0.002mm
Y-axis Drive Linear motor
Stroke(Working range) Max.160mm
Resolution 0.001mm
Step size 0.001mm
Accuracy <0.006mm/150mm
Repeat accuracy 0.002mm
θ-axis Drive DD motor
Rotation range 360°
Revolving 120rpm
Resolution 0.0005°
Panel OS Windows
Operation interface English, Touch-screen
Microscope light LED
Working condition Power supply Two phase 220-240ACV；50HZ
Max. Power consumption 1.5 Kw
Compress air pressure 0.4-0.8MPa
Exhaust air 5m³/min
Dimension D*W*H 1220mm×810mm×1650mm
Weight Approx.660KG